| 摘要 |
A leadless multi-chip electronic module (30, 32) with leadframe bond pads is manufactured in a manner to place small signal bond pads (34) in a central region of the module for significantly increased reliability of solder joints between such bond pads (34) and a substrate (18) of the module. A linear array of parallel leadframe elements (50) disposed in a central region of the module and bridging first and second larger IC leadframe bond pads (36, 38) are converted into signal bond pads (34) by a pair of partial bottom-side saw cuts. The saw cuts run parallel to and adjacent the first and second IC bond pads (36, 38) to electrically isolate the leadframe elements (50) from the IC bond pads (36, 38) and other bond pads. The partial saw cuts are made following encapsulation and preferably before leadframe singulation. |
