An apparatus and method for electroplating a substrate in a continuous way.

摘要

The invention relates to an apparatus and to a method for depositing a metal coating on an electrically conductive substrate (16) in a continuous way.
The apparatus comprises
- a plating vessel (11) for receiving an electrolyte solution (12);
- at least one first electrode (13) (anode) connected to a positive pole of a power supply (15);
- at least one second electrode (14) (cathode) connected to a negative pole of a power supply;
- means to pass the substrate through the plating vessel in a predetermined direction at a predetermined distance from the first and the second electrode.
The substrate is functioning as a cathode having a current density Jc when the substrate is facing the first electrode, whereas the substrate is functioning as an anode having a current density Ja when the substrate is facing the second electrode.