发明名称 |
Method for assembling a ball grid array package with two substrates |
摘要 |
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
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申请公布号 |
US7312108(B2) |
申请公布日期 |
2007.12.25 |
申请号 |
US20050076873 |
申请日期 |
2005.03.11 |
申请人 |
BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZINQUN;KHAN REZA-UR RAHMAN;CHAUDHRY IMTIAZ |
分类号 |
H01L21/00;H01L23/16;H01L23/31;H01L23/367;H01L23/433 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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