摘要 |
For a semiconductor device S as an inspected object, there are provided an image acquisition part 1 , an optical system 2 including an objective lens 20 , and a solid immersion lens (SIL) 3 movable between an insertion position including an optical axis from the semiconductor device S to the objective lens 20 and a standby position off the optical axis. Then observation is carried out in two control modes consisting of a first mode in which the SIL 3 is located at the standby position and in which focusing and aberration correction are carried out based on a refractive index n<SUB>0 </SUB>and a thickness t<SUB>0 </SUB>of a substrate of the semiconductor device S, and a second mode in which the SIL 3 is located at the insertion position and in which focusing and aberration correction are carried out based on the refractive index n<SUB>0 </SUB>and thickness t<SUB>0 </SUB>of the substrate, and a refractive index n<SUB>1</SUB>, a thickness d<SUB>1</SUB>, and a radius of curvature R<SUB>1 </SUB>of SIL 3 . This provides a microscope and a sample observation method capable of readily performing observation of the sample necessary for an analysis of microstructure or the like of the semiconductor device.
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