发明名称 |
Structure and method for producing multiple size interconnections |
摘要 |
An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter. |
申请公布号 |
US7312529(B2) |
申请公布日期 |
2007.12.25 |
申请号 |
US20050160669 |
申请日期 |
2005.07.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CLEVENGER LAWRENCE;FAROOQ MUKTA G.;HSU LOUIS L.;LANDERS WILLIAM F.;ZUPANSKI-NIELSEN DONNA S.;RADENS CARL J.;YANG CHIH-CHAO |
分类号 |
H01L23/48;H01L23/40;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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