| 摘要 |
A semiconductor chip inspection supporting apparatus includes a data processing unit. To the data processing unit, an image data is supplied. The image data indicates a layout of a plurality of normal chips and a plurality of abnormal chip on a semiconductor wafer. The data processing unit includes a data processing unit and a search processing portion. The generation portion generates a connection propriety data indicating prohibition of each of the plurality of normal chips from being connected to adjacent one of the plurality of abnormal chips based on the image data. The search processing portion searches for a chip to be paired with the each of plurality of the normal chips for execution of paired measurement, based on the image data and the connection propriety data. The data processing unit outputs the search result.
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