| 摘要 |
An anisotropic conductive film composition, and an anisotropic conductive film formed from the composition are provided to improve initial adhesive strength, to reduce contact resistance and to prevent the generation of short between circuits, thereby enhancing productivity. An anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-50 wt% of a (meth)acrylate oligomer; 1-30 wt% of a (meth)acrylate monomer; 0.1-15 wt% of a radical initiator; and 0.01-20 wt% of a conductive particle. Also an anisotropic conductive film composition comprises 5-50 wt% of a thermoplastic resin; 5-50 wt% of a styrene-acrylonitrile copolymer resin; 1-80 wt% of at least one of epoxy monomer, oligomer or resin selected from the group consisting of bisphenolic, novolac, glycidyl, aliphatic and alicyclic epoxy compounds; 0.1-15 wt% of a thermal curing agent for epoxy; and 0.01-20 wt% of a conductive particle.
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