ELECTRONIC SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC EQUIPMENT MANUFACTURING METHOD

摘要

A method of manufacture of an electronic substrate, having a process of embedding electronic components (40, 41, 42) in a substrate (5), and a process of ejecting liquid droplets containing a conductive material, to form a wiring pattern (23) connected to the external connection electrodes (40a, 41a, 42a) of the electronic components (40, 41, 42) embedded in the substrate (5).