发明名称 Tape substrate improving EMI noise characteristics and tape package using the same
摘要 A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersion wiring patterns to a first end of the adjacent input/output wiring pattern.
申请公布号 KR100788415(B1) 申请公布日期 2007.12.24
申请号 KR20060029662 申请日期 2006.03.31
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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