THERMAL INTERFACE BONDING STRUCTURE AND METHOD USING CARBON NANOTUBE

摘要

A thermal interface junction structure using carbon nano-tube and a method thereof are provided to improve the conductivity by inserting a thermal interface material into the gap formed between two metal surfaces which are joined by mutual thermal interface junction and coating as carbon nano-tube very small gap which can not be filled with the thermal interface material. For a thermal interface junction in order to deliver heat by contacting the two of metal surfaces together, the thermal interface junction structure using carbon nano-tube is the structure that the contacted surface of each metal is coated by the carbon nano-tube, and that uses the carbon nano-tube which inserts the thermal interface material between the contacted surfaces of metals. The conductivity between two metals which are joined by mutual thermal interface junction can be improved.