<p>A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.</p>
申请公布号
WO2007146582(A2)
申请公布日期
2007.12.21
申请号
WO2007US69806
申请日期
2007.05.25
申请人
FORMFACTOR, INC.;MILLER, CHARLES, A.;SPORCK, A., NICHOLAS;ELDRIDGE, BENJAMIN, N.
发明人
MILLER, CHARLES, A.;SPORCK, A., NICHOLAS;ELDRIDGE, BENJAMIN, N.