METHOD FOR MANUFACTURING A DEVICE FOR SUPPORTING A SUBSTRATE DURING THE MANUFACTURE OF SEMICONDUCTOR COMPONENTS, AS WELL AS SUCH A DEVICE

摘要

The invention relates to a method for manufacturing a device (10) for supporting a substrate during the manufacture of semiconductor components, which device (10) comprises a substantially flat plate having an upper surface (10a), on which the substrate is to be positioned, the upper surface (10a) of which plate initialy has a flat surface, whilst at least that part of said upper surface (10a) on which the substrate is to be positioned receives a surface roughness. The surface roughness is formed contactless by pulsed electromagnetic radiation in the initial flat surface of the upper surface (10a) of the flat plate. The invention also relates to a device (10) manufactured by using the method according to the invention, which device (10) is arranged for supporting a substrate during the manufacture of semiconductor components, and which comprises a substantially flat plate having an upper surface (10a), on which the substrate is to be positioned, the upper surface (10a) of which plate has a substantially flat surface, whilst at least that part of the upper surface (10a) on which the substrate is to be positioned has a surface roughness, which extends below the initial flat surface of the upper surface (10a) of the flat plate.