STACKED CHIPS WITH UNDERPINNING

摘要

A multi-chip semiconductor package (10) and methods of manufacture are disclosed. In described embodiments, a first semiconductor chip (14) is affixed to a package substrate (12) and a second semiconductor chip (16) is affixed to at least a portion of a surface of the first semiconductor chip, forming an overhang (22). Underpinning (28) is interposed for supporting the overhang in order to resist deflection during assembly.