IMPROVED ELECTRODES, INNER LAYERS, CAPACITORS AND PRINTED WIRING BOARDS AND METHODS OF MAKING THEREOF - PART II

摘要

Disclosed is an improved method of embedding capacitors in printed wiring boards (PWB) made from thick film dielectrics and electrodes, the method comprising the steps of : providing a metallic foil; forming a ceramic dielectric over the metallic foil; forming an electrode over most of said dielectric and at least a portion of said metallic foil; firing the capacitor structure under base metal firing conditions; and etching the metallic foil to form a second electrode. Further the method may comprise forming an insulating isolation layer over the metallic foil before forming the ceramic dielectric.