发明名称 |
ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME |
摘要 |
<p>An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.</p> |
申请公布号 |
WO2007145711(A1) |
申请公布日期 |
2007.12.21 |
申请号 |
WO2007US09917 |
申请日期 |
2007.04.24 |
申请人 |
DOW CORNING CORPORATION;ALBAUGH, JOHN;CAMILLETTI, ROBERT |
发明人 |
ALBAUGH, JOHN;CAMILLETTI, ROBERT |
分类号 |
H01L23/29;G03F7/075;H01L23/31 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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