发明名称 ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME
摘要 <p>An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.</p>
申请公布号 WO2007145711(A1) 申请公布日期 2007.12.21
申请号 WO2007US09917 申请日期 2007.04.24
申请人 DOW CORNING CORPORATION;ALBAUGH, JOHN;CAMILLETTI, ROBERT 发明人 ALBAUGH, JOHN;CAMILLETTI, ROBERT
分类号 H01L23/29;G03F7/075;H01L23/31 主分类号 H01L23/29
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