| 摘要 |
<p>The present invention relates to a solder paste containing 70 to 90wt% of a solder powder having the melting point of 100 to 250°C; 5 to 15wt% of an ultraviolet curable or degradable photosensitive polymer; 0.5 to 2wt% of an additive; and 4.5 to 13wt% of a composite solvent, and a method for forming solder bumps using the solder paste. The solder bumps can be formed so as to have a fine width of a few or a few tens of micrometers, thereby easily achieving miniaturization and increased integration of semiconductor devices. In addition, the process is very simplified to realize an improvement in the process yield and mass production.</p> |
