ELECTROLESS NIP ADHESION AND/OR CAPPING LAYER FOR COPPER INTERCONNEXION LAYER

摘要

A method of depositing a copper interconnection layer on a substrate such on a glass substrate for use e.g. in TFT-LCD flat panel interconnection system. The method according to the invention comprising the steps of: a) optionally cleaning the substrate, b) optionally micro-etching the substrate, c) depositing a catalyzation layer on the substrate to obtain a catalyzed substrate, d) conditioning the catalyzed substrate with a conditioning solution to obtain a conditioned catalyzed substrate, e) plating the catalyzed substrate with a NiP layer by contacting said substrate or at least a portion thereof with a wet bath mixture comprising precursors of Ni and P, f) depositing a copper catalyst layer onto the plated NiP layer, depositing a Cu layer on said copper catalyst layer.