| 摘要 |
A wafer cleaning apparatus is provided to transfer a wafer continuously by including a conveyor belt having an inner surface of a saw tooth shape gearing with a motor pulley or belt pulley of a toothed wheel shape. A plurality of brushes(250) polish front and back surfaces of a wafer(222), confronting each other. A plurality of toggle rollers(260) rotate the wafer, supporting the lateral surface of the wafer between the plurality of brushes. A plurality of brackets(252) are formed in a manner that the plurality of brushes are closely attached to or separated from the front and back surfaces of the wafer, supporting the plurality of brushes. An interval control part(254) controls an interval between the plurality of brackets. A sensor(270) measures an interval between the plurality of brackets and detects if the plurality of brushes are closely attached to the front and back surfaces of the wafer.
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