MICROELECTRONIC ASSEMBLY WITH BACK SIDE METALLIZATION AND METHOD FOR FORMING THE SAME
摘要
A method is provided for forming a microelectronic assembly (20, 70). A contact structure (46) is formed over a first side of a first substrate (20) having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer (52) is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate (62) are interconnected with solder (68).
申请公布号
WO2007146478(A1)
申请公布日期
2007.12.21
申请号
WO2007US65922
申请日期
2007.04.04
申请人
FREESCALE SEMICONDUCTOR INC.;HILL, DARRELL G.;BOWLES, PHILIP H.;CAMPBELL, JAN;DALY, TERRY K.;FENDER, JASON R.;RAMANATHAN, LAKSHMI N.
发明人
HILL, DARRELL G.;BOWLES, PHILIP H.;CAMPBELL, JAN;DALY, TERRY K.;FENDER, JASON R.;RAMANATHAN, LAKSHMI N.
