| 摘要 |
<p>Disclosed are methods for transferring heat, methods for heating and cooling, and a solid-state heat pump. A described solid-state heat pump (100) includes a power supply (120) that provides an electric field, a first metal layer (112), a dielectric layer (114) disposed over the first metal layer, wherein the dielectric layer absorbs a first amount of heat (132) upon application of the electric field and releases a second amount of heat (142) upon alteration of the electric field, and wherein the second amount of heat is greater than the first amount of heat, and a second metal layer (116) disposed over the dielectric layer. The alteration of the electric field can be achieved at least by one of reducing, removing, and/or reversing the polarity of the electric field. The solid-state heat pump can also include a series resistor.</p> |
