| 摘要 |
<p>A method for manufacturing a circuit board is provided to implement an LSI(Large Scale Integration) on the circuit board by planarizing a surface of the circuit board by burying a wiring pattern in an insulation layer. In a photolithography process, a third metal layer(65) of a 3-layer metal laminate(62) is etched to form a predetermined line pattern. A laminate electrically connected to a wiring pattern between layers through an insulation layer is formed on the wiring pattern by using a build-up process. The laminate is peeled from a base board between a first metal layer(63) and the base board. The first metal layer of the laminate is etched by using a second metal layer(64) as a barrier layer. The exposed second metal layer is etched.</p> |
