发明名称 NON-PLANAR SURFACE STRUCTURES AND PROCESS FOR MICROELECTROMECHANICAL SYSTEMS
摘要 Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Apertures are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. Other layers may be formed over the formed apertures. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area and/or a larger surface separation between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
申请公布号 WO2007126844(A3) 申请公布日期 2007.12.21
申请号 WO2007US07613 申请日期 2007.03.27
申请人 QUALCOMM INCORPORATED;TUNG, MING-HAU;AKELLA, SRIRAM;CUMMINGS, WILLIAM, J.;KOGUT, LIOR 发明人 TUNG, MING-HAU;AKELLA, SRIRAM;CUMMINGS, WILLIAM, J.;KOGUT, LIOR
分类号 B81C1/00 主分类号 B81C1/00
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