| 摘要 |
<p>A light emitting apparatus is disclosed. The light emitting apparatus includes a substrate, a heat sink, a dielectric layer, conductive traces, a reflector, and at least one photonic device. The substrate has a top surface and a bottom surface, a portion of the top surface defining a mounting pad. The heat sink is equipped with cooling fins to cool the substrate. The conductive traces are on the top surface of the substrate and extend from the mounting pad to a side edge of the substrate. The reflector is attached to the top surface of the substrate. The reflector surrounds the mounting pad partially covering the top surface of the substrate. The photonic device is attached to the substrate at the mounting pad, the photonic device connected to at least one conductive trace. The light emitting apparatus can be mounted on a board having connection traces. The connection traces of the board are aligned with the conductive trace of the light emitting apparatus to effect electrical connection.</p> |
