| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a multilayer circuit board capable of sufficiently reducing unnecessary radiant noises. <P>SOLUTION: In the multilayer circuit board, a laminate is configured by superposing a first signal electrode layer 40, a ground electrode layer 30, a power-supply electrode layer 20, and a second signal electrode layer 10 in the order. An IC 60 is mounted on the top face of the multilayer circuit board, and a three-terminal capacitor 46 is mounted on a rear. A land 42 for mounting the input side and an input-side power supply pattern 41 connected to the land 42 for mounting the input side are fitted to the first signal electrode layer 40. The land 43 for mounting the output side, an output-side power supply pattern 44 connected to the land 43 for mounting the output side, and the land 45 for mounting the ground-side, are further fitted to the first signal electrode layer 40. A power-supply electrode 21 is installed to the power-supply electrode layer 20, and the land 11 for mounting the IC is installed to the second signal electrode layer 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
