发明名称 PACKAGE, AND ITS TERMINAL FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a package and its terminal forming method which improve the workability at the time of verifying the action by contacting mutually the package and a jig substrate, while protecting the exfoliation of a terminal formed in the package. SOLUTION: While a first terminal 5a is formed in a wiring board 2, the periphery of the first terminal 5a is covered with a coating material 6. Furthermore, a second terminal 5b higher than the height of the coating material 6 is formed by overlaying the part except the periphery covered with the coating material 6 in the first terminal 5a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329390(A) 申请公布日期 2007.12.20
申请号 JP20060160961 申请日期 2006.06.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 AKIBA NAOKI;HASE HIDEKAZU
分类号 H01L23/12 主分类号 H01L23/12
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