摘要 |
PROBLEM TO BE SOLVED: To provide a package and its terminal forming method which improve the workability at the time of verifying the action by contacting mutually the package and a jig substrate, while protecting the exfoliation of a terminal formed in the package. SOLUTION: While a first terminal 5a is formed in a wiring board 2, the periphery of the first terminal 5a is covered with a coating material 6. Furthermore, a second terminal 5b higher than the height of the coating material 6 is formed by overlaying the part except the periphery covered with the coating material 6 in the first terminal 5a. COPYRIGHT: (C)2008,JPO&INPIT
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