| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for suppressing a substrate from its generated cracks when attaching to solid imaging elements formed on the substrate such another member as a transparent substrate to modularize the solid imaging elements. SOLUTION: The manufacturing method of modularized solid imaging elements has first, second, and third processes. In the first process, the substrate having a plurality of solid imaging elements, i.e., the element possessing substrate is opposed to a transparent substrate to stick them to each other. In the second process, there is polished the rear surface of the surface of the element possessing substrate. In the third process, before the process for polishing the rear surface, there is stuck to the surface of the element possessing substrate a sealant for sticking the transparent substrate to the element possessing substrate. Hereupon, the size of the sealant sticking surface is made wider than the size of the surface of the element possessing substrate. COPYRIGHT: (C)2008,JPO&INPIT
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