| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic apparatus capable of circulating a flow of cooling air uniformly through a cooled unit with a small pressure loss, even if a distance is small between a cooling fan and the cooled unit. SOLUTION: When a cooling fan 1 is driven to make a flow of cooling air blow off through an air outlet 2, the flow of cooling air produces a turbulent flow once hitting the internal surface of a chamber 9, in an area where the projection profile of the air outlet 2 never overlaps with that of the vent hole 4 of a heat sink 3 in opposite directions. Accordingly, the flow of cooling air expands wide in the chamber 9, and is sent well to even a ventilation path 12 located near the side edge of the heat sink 3 to lean toward the air outlet 2 of the cooling fan 1 slightly deviating in the direction of a Y axis. Even when a distance between the cooling fan 1 and the heat sink 3 is small, the flow of cooling air circulates uniformly in the direction of an X axis in the ventilation paths 12 communicating with the vent holes 4 of the heat sink 3. Consequently, semiconductor devices mounted on a circuit board 7 located on the heat sink 3 are effectively cooled down. Fins used for forcibly deflecting the flow of cooling air are not provided inside the chamber 9, so that a pressure loss can be reduced. COPYRIGHT: (C)2008,JPO&INPIT
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