| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which enhances the reliability of connection between the semiconductor device and a counterpart substrate in mounting the semiconductor device on a glass substrate or the like, and reduces the manufacturing cost of an electro-optical device or the like, and also to provide a mounting structure using the semiconductor device, an electro-optical device using the semiconductor device, a manufacturing method of the electro-optical device, and an electronic apparatus using the electro-optical device. <P>SOLUTION: A semiconductor device, e.g. an integrated circuit (IC) 23 for driving a liquid crystal is formed so that the height from the mounting surface 28 of a second projection part 33 is lower than the height from the mounting surface 28 of a first projection part 30. Thus, the gap that is formed between the counterpart substrate and the second projection part 33 in mounting can be adjusted, and the most suitable flow rate of an adhesive can be secured. The first projection part 30 is more suitably deformed in mounting, compared with the case where the second projection part 33 is completely removed, since it is supported by the second projection part 33 that is provided at least on one side. The state is also stably maintained. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
