| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily and inexpensively manufacture a multilayer printed-wiring board with a small number of manufacturing processes and with improved yields, which board can cope with a high-frequency circuit by reducing an electric signal path length. <P>SOLUTION: Double-sided printed-wiring boards 1, 2 having a through-hole 9 are prepared and are laminated by aligning each through-hole and performing crimping by holding an insulation resin (electrical insulator) 5. Then, communication holes 14 for connecting each through-hole is formed by removing an insulation resin for blocking each through-hole. The communication holes are filled with a conductor such as a conductive paste 6 to form electrical conductive paths 15, and a plurality of double-sided printed-wiring boards are electrically connected. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
