| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device cutting system capable of cutting semiconductor devices including an oddly shaped line from a semiconductor substrate at high speed, and ensuring good-quality cutting surface. <P>SOLUTION: The semiconductor cutting system cuts semiconductor devices 135' by cutting the semiconductor substrate 120 along scheduled cutting lines having a first portion, and a second portion having a shape different from the first portion. The semiconductor cutting system has a blade cutter 200 for cutting the semiconductor substrate along the first portion by using a cutting blade, and a laser cutter 100 for cutting the semiconductor substrate along the second portion by using a laser beam. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
