发明名称 |
Molding Methods To Manufacture Single-Chip Chip-On-Board USB Device |
摘要 |
A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
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申请公布号 |
US2007293088(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20070773830 |
申请日期 |
2007.07.05 |
申请人 |
SUPER TALENT ELECTRONICS, INC. |
发明人 |
HIEW SIEW S.;NI JIM C.;LEE CHARLES C.;YU I-KANG;SHEN MING-SHIANG |
分类号 |
H01R13/648;G06F3/00 |
主分类号 |
H01R13/648 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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