| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method of manufacturing a base material for a wiring circuit board that improves bonding strength between an electronic component and a wiring circuit board; a method of manufacturing a wiring circuit board, and a wiring circuit board. SOLUTION: The base material 1 for a wiring circuit board is manufactured by laminating an insulating resin film 10 and a metal foil 20 by using laminate rollers LR1, LR2. A rust-proof treated layer including chromium is formed on the surface of the metal foil 20. The temperature of the laminate rollers LR1, LR2 is set to 330-390°C. A contact time is set to 0.5-4.0 seconds between the metal foil 20 and the laminate roller LR1 (time required for moving the metal foil 20 from a position (a) to a position (b)), immediately before the time point of contact between the insulating resin film 10 and the metal foil 20. COPYRIGHT: (C)2008,JPO&INPIT
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