| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck device which can provide a patterning process of increasing a product yield, and stabilizing dry etching by controlling discharge in the interior of an He gas supply hole. SOLUTION: In the electrostatic chuck device, a ceramic shaft 11 is inserted in an He gas supply hole 12, so that an available discharge space can be decreased, discharge in the interior of the He gas supply hole 12 can be suppressed, discharge on the backside of a wafer 16 can be prevented, and damage of the wafer 16 can be prevented. COPYRIGHT: (C)2008,JPO&INPIT |
