| 摘要 |
PROBLEM TO BE SOLVED: To enable a polyglycolic acid resin film of which the gas barrier property is significantly improved to be stably manufactured by the air cooling inflation method of a simple device constitution. SOLUTION: The polyglycolic acid resin has a melting viscosity (V) of 300 to 2,000 Pa s at the temperature of 270°C and the shearing speed of 122 s<SP>-1</SP>. The polyglycolic acid resin is extruded from an annular die at a resin temperature (T°C) which satisfies the equation (1): 212 exp(0.0004×V)<T<220 exp(0.0001×V), and is inflation-molded while being cooled with air in the manufacturing method for the polyglycolic acid resin film by the air cooling inflation method. COPYRIGHT: (C)2008,JPO&INPIT |
