发明名称 SUBSTRATE ASSEMBLING APPARATUS AND SUBSTRATE ASSEMBLING METHOD USING THE SAME
摘要 A technique which solves the problem of conventional laminating apparatuses that a substrate may be deformed when released by pushing lift pins against the substrate held on an adhesive member by suction. An upper table inside a chamber has, on its substrate holding face, an elastic plate provided with an elastic body, a vacuum suction means and a purge gas blow means. A plurality of adhesive pins are provided on an adhesive pin plate which can move up and down independently from the upper table. The upper table and the elastic plate have through holes through which the adhesive pins can move and the adhesive pins have adhesion means at their tips.
申请公布号 US2007289711(A1) 申请公布日期 2007.12.20
申请号 US20070748525 申请日期 2007.05.15
申请人 KAIZU TAKUYA;IMAI HIROAKI;SAITO MASAYUKI 发明人 KAIZU TAKUYA;IMAI HIROAKI;SAITO MASAYUKI
分类号 B32B37/10 主分类号 B32B37/10
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