发明名称 |
FINGERPRINT INPUT APPARATUS AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable fingerprint identification device, while reducing a thickness and a cost. <P>SOLUTION: A fingerprint input apparatus includes: a semiconductor substrate 1 with a solid imaging device 1a formed on a circuit surface; a first wiring board 2 mounting the semiconductor substrate 1 with the rear surface of the semiconductor substrate 1 facing a front side; a second wiring board 5 for mounting the first wiring board 2 from the opposite surface side of the semiconductor substrate 1 of the first wiring board 2; an LED 3 for illumination mounted on the second wiring board 5 and in the adjacent region of the first wiring board 2; and an insulating resin 4 filled in a gap between the semiconductor substrate 1 and the first wiring board 2. The first wiring board 2 includes a light shielding pattern 2a in a part facing the solid imaging device 1a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007328511(A) |
申请公布日期 |
2007.12.20 |
申请号 |
JP20060158578 |
申请日期 |
2006.06.07 |
申请人 |
NEC ELECTRONICS CORP |
发明人 |
SUGIMOTO TOMONOBU;TANABE AKIRA |
分类号 |
G06T1/00;A61B5/117;H05K1/14;H05K1/18 |
主分类号 |
G06T1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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