| 摘要 |
A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A portion of the second silicon layer is etched to form a slider portion and a layer portion. The slider portion is movable relative to the layer portion. A portion of the first silicon layer is coated with a coating material that has a size and shape that corresponds to the size and shape of the slider portion. The first silicon layer is then positioned over the second silicon layer such that the coated portion of the first silicon layers substantially aligned with the slider portion of the second silicon layer. A bonding operation is performed to bond the first silicon layer to the second silicon layer The coating material separates the slider portion from the first silicon layer during the bonding operation to prevent the slider portion from bonding with the first layer This method can also be implemented by selectively coating portions of the first silicon layer with a coating that will enhance or cause bonding only in areas adjacent to the coating material. A hybrid process whereby one material is placed in portions of the first silicon layer to prevent bonding and a second material is placed in other portions of the first silicon layer to enhance or cause bonding is also possible.
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