| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive composition having high sensitivity to a blue-violet laser exposure system, excellent in storage stability and plating resistance, giving a thick film suitable for forming a bump pattern, a wiring pattern or the like, and suitable for forming a high-definition bump pattern, a high-definition wiring pattern or the like with high resolution, a photosensitive film, a pattern forming method for forming a pattern such as a bump pattern or a wiring pattern, and a printed circuit board. <P>SOLUTION: The photosensitive composition comprises a phenolic hydroxyl group-containing resin, a resin containing benzyl, carboxyl and hydroxyl groups, a crosslinking agent which achieves crosslinking under an acid, and a photoacid generator having an absorption maximum at a wavelength of 350-420 nm, wherein the sensitivity of the photosensitive composition at a wavelength of 405 nm is 10-100 mJ/cm<SP>2</SP>. There are also provided the photosensitive film using the photosensitive composition, the pattern forming method using the photosensitive composition, etc., and the printed circuit board formed by the pattern forming method. <P>COPYRIGHT: (C)2008,JPO&INPIT |
