发明名称 CARRIER TOOL, AND ITS MANUFACTURING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a carrier tool in which sufficient adhesiveness can be attained even if the hardness is not high, detachment of conductive filler and increase in filling amount are not caused, and the conductivity does not deteriorate even if it is exposed to high temperature. <P>SOLUTION: The carrier tool comprises a rigid carrier plate 20, and an adhesive layer 30 lamination-bonded to the carrier plate 20 and adhesion holding a flexible printed wiring board 10 removably. Conductivity is imparted to the carrier plate 20 and the adhesive layer 30 and, when the flexible printed wiring board 10 is stripped from the adhesive layer 30, damage is controlled on an electronic component mounted on the flexible printed wiring board 10 due to static electricity. The adhesive layer 30 is formed of such a material as at least any one of carbon nanotube, and carbon microcoil is added to adhesive having adhesion ingredient. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329182(A) 申请公布日期 2007.12.20
申请号 JP20060157433 申请日期 2006.06.06
申请人 SHIN ETSU POLYMER CO LTD 发明人 KOMATSU HIROTO
分类号 H05K3/34;H05K13/04 主分类号 H05K3/34
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