发明名称 CIRCUIT BOARD, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a circuit board which can prevent a short-circuit between circuits and between lands caused by a side ball, and can secure a strength of the lands. SOLUTION: In the circuit board 10; a recess 26 which is lower than a height of a land 16 is formed between a pair of lands 16, 16, and land outer fringes 16B, 16C, 16D except for an outer fringe 16A opposite to the pair of lands 16, 16 are covered with a resist 22. According to this circuit board 10, as a cream solder 24 projecting from a gap between the lands 16, 16 and a mounting component 12 flows out and stores into the recess 26, an occurrence of the side ball can be prevented. Also, as the outer fringes 16B, 16C, 16D except for the outer fringe 16A opposite to the pair of lands 16, 16 are covered with the resist 22, the lands 16, 16 of the circuit board 10 are difficult to peel off from a board 14, thereby ensuring a strength of the land 16. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329407(A) 申请公布日期 2007.12.20
申请号 JP20060161301 申请日期 2006.06.09
申请人 FUJIFILM CORP 发明人 YAMASAKO HIROSHI
分类号 H05K3/34 主分类号 H05K3/34
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