发明名称 Mounting Condition Determining Method, Mounting Condition Determining Device, and Mounter
摘要 According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate. The method includes: obtaining a setting value of a parameter regarding electricity consumption required to mount the component; obtaining an actual value of the parameter based on current mounting conditions; and determining new mounting conditions based on a result of comparing the setting value with the actual value.
申请公布号 US2007293969(A1) 申请公布日期 2007.12.20
申请号 US20060664417 申请日期 2006.02.08
申请人 HIRAI WATARU;MAENISHI YASUHIRO;KURATA HIROAKI;KONISHI CHIKASHI;NAKAHARA KAZUHIKO;FUJITA MASAKATSU;YAMAZAKI TAKUYA;YOKOI TAKAAKI 发明人 HIRAI WATARU;MAENISHI YASUHIRO;KURATA HIROAKI;KONISHI CHIKASHI;NAKAHARA KAZUHIKO;FUJITA MASAKATSU;YAMAZAKI TAKUYA;YOKOI TAKAAKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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