发明名称 |
THIN FILM SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND DISPLAY |
摘要 |
A method of manufacturing a thin film semiconductor device is disclosed. The method includes the steps of: forming a light reflection and absorption layer for reflecting and absorbing light on a substrate; patterning the light reflection and absorption layer in a prescribed shape; forming an insulating film covering the patterned light reflection and absorption layer; forming a semiconductor thin film containing a polycrystalline grain on the insulating film; and laser annealing the semiconductor thin film by irradiating pulse oscillated laser light to crystallize the semiconductor thin film. The laser annealing step includes a heating process, and a cooling process.
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申请公布号 |
US2007290200(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20070753751 |
申请日期 |
2007.05.25 |
申请人 |
SONY CORPORATION |
发明人 |
ASANO AKIHIKO |
分类号 |
G02F1/13;H01L21/20;H01L21/336;H01L29/786;H01L51/52 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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