发明名称 THIN FILM SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND DISPLAY
摘要 A method of manufacturing a thin film semiconductor device is disclosed. The method includes the steps of: forming a light reflection and absorption layer for reflecting and absorbing light on a substrate; patterning the light reflection and absorption layer in a prescribed shape; forming an insulating film covering the patterned light reflection and absorption layer; forming a semiconductor thin film containing a polycrystalline grain on the insulating film; and laser annealing the semiconductor thin film by irradiating pulse oscillated laser light to crystallize the semiconductor thin film. The laser annealing step includes a heating process, and a cooling process.
申请公布号 US2007290200(A1) 申请公布日期 2007.12.20
申请号 US20070753751 申请日期 2007.05.25
申请人 SONY CORPORATION 发明人 ASANO AKIHIKO
分类号 G02F1/13;H01L21/20;H01L21/336;H01L29/786;H01L51/52 主分类号 G02F1/13
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