| 摘要 |
PROBLEM TO BE SOLVED: To cut out a wafer with high thickness accuracy and high plane accuracy of a cutting face. SOLUTION: The wire saw has: a group of wires formed by wires W wound around guide rollers 24A, 24B; a drive motor driving this group of wires; a workpiece feeding device 30 cutting and feeding a workpiece 28; and slurry supplying devices 36A, 36B supplying slurry to the wire W. The wire saw also has: a flexion sensor 38 detecting a flexion quantity of the wire W; a controller controlling the workpiece feeding device 30 for executing a workpiece return action for once returning the workpiece 28 in a direction opposite to a cutting and feeding direction relatively to the group of wires and cutting and feeding it again; and return quantity calculation means for finding a return quantity of the workpiece in the workpiece return action by subtracting a preset safety value from a value detected by the flexion sensor 38. The controller returns the workpiece 28 by a return quantity found by the return quantity calculation means in the workpiece return action. COPYRIGHT: (C)2008,JPO&INPIT |
