发明名称 THERMOPLASTIC RESIN COMPOSITION OF HIGH THERMAL CONDUCTIVITY
摘要 PROBLEM TO BE SOLVED: To provide an inorganic matter-containing thermoplastic resin composition of high thermal conductivity while practically retaining various properties such as both mechanical properties and molding processability inherent in general-purpose resins. SOLUTION: The thermoplastic resin composition consists of a polymer alloy composed of one or more thermoplastic resins synthesized using a styrene-based monomer and/or a (meth)acrylic monomer/a polyamide resin/a highly thermally conductive inorganic compound. In the polymer alloy, the polyamide resin forms a continuous phase, and by preferentially making the inorganic compound exist in the phase other than the above thermoplastic resin(s), the thermal conductivity of this resin composition can be efficiently improved by merely adding a relatively small amount of the inorganic compound. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007327010(A) 申请公布日期 2007.12.20
申请号 JP20060161477 申请日期 2006.06.09
申请人 KANEKA CORP 发明人 MATSUMOTO KAZUAKI;YOSHIDA TATSUSHI
分类号 C08L25/00;C08K3/22;C08K3/28;C08L33/00;C08L77/00 主分类号 C08L25/00
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