| 发明名称 |
Microelectronic assembly with back side metallization and method for forming the same |
| 摘要 |
A method is provided for forming a microelectronic assembly. A contact structure ( 46 ) is formed over a first side of a first substrate ( 20 ) having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer ( 52 ) is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate ( 62 ) are interconnected with solder ( 68 ).
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| 申请公布号 |
US2007293033(A1) |
申请公布日期 |
2007.12.20 |
| 申请号 |
US20060453763 |
申请日期 |
2006.06.14 |
| 申请人 |
HILL DARRELL G;BOWLES PHILIP H;CAMPBELL JAN;DALY TERRY K;FENDER JASON R;RAMANATHAN LAKSHMI N;TRACHT NEIL T |
发明人 |
HILL DARRELL G.;BOWLES PHILIP H.;CAMPBELL JAN;DALY TERRY K.;FENDER JASON R.;RAMANATHAN LAKSHMI N.;TRACHT NEIL T. |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
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