发明名称 |
Substrate Processing Method and Substrate Processing Apparatus |
摘要 |
Disclosed is a substrate processing method wherein the infrared absorptance or infrared transmittance of a substrate to be processed is measured in advance, and the substrate is processed according to the measured value while independently controlling temperatures at least in a first region located in the central part of the substrate and in a second region around the first region using temperature control means which are respectively provided for the first region and the second region and can be controlled independently from each other.
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申请公布号 |
US2007292598(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20060667945 |
申请日期 |
2006.04.04 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
TADA KUNIHIRO;MIYASHITA HIROYUKI;GUNJI ISAO |
分类号 |
C23C16/46;H01L21/02;H01L21/285 |
主分类号 |
C23C16/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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