发明名称 Substrate Processing Method and Substrate Processing Apparatus
摘要 Disclosed is a substrate processing method wherein the infrared absorptance or infrared transmittance of a substrate to be processed is measured in advance, and the substrate is processed according to the measured value while independently controlling temperatures at least in a first region located in the central part of the substrate and in a second region around the first region using temperature control means which are respectively provided for the first region and the second region and can be controlled independently from each other.
申请公布号 US2007292598(A1) 申请公布日期 2007.12.20
申请号 US20060667945 申请日期 2006.04.04
申请人 TOKYO ELECTRON LIMITED 发明人 TADA KUNIHIRO;MIYASHITA HIROYUKI;GUNJI ISAO
分类号 C23C16/46;H01L21/02;H01L21/285 主分类号 C23C16/46
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