A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE

摘要

A dicing method for a semiconductor device package is provided to obtain an improved package separation method for a WLP(wafer level package) by including a buffer layer capable of preventing a dice or a substrate from being damaged when the dice or a lateral part of the substrate collides with an external object. A die(205) with a plurality of electrical connection parts is formed on a first surface of a die. A plurality of conductive balls are connected to the electrical connection parts. A substrate(202) is fixed to a second surface of the die. A first buffer layer is formed on the substrate, adjoining the die. A second buffer layer is formed on the substrate confronting the first buffer layer. The substrate and the second buffer layer have a concave part as compared with the first buffer layer. The first or second buffer layer can be made of a material including photo epoxy.