| 摘要 |
PROBLEM TO BE SOLVED: To provide a new polynuclear polyphenol compound useful as a base material for photosensitive materials such as photoresists for semiconductor use, a raw material for epoxy resins used as sealing materials for integrated circuits, a curing agent, a developer or fading inhibitor for thermal recording materials or the like, or an additive such as a microbicide or bactericide/fungicide. SOLUTION: The new polynuclear polyphenol compound is constituted by, as the main skeleton, a 4,4'-methylene bisphenol structure where tris-phenol skeletons of tris-phenylmethane type are mutually bound via methylene groups, wherein the reactivity of two hydroxy groups bound to the central skeleton of 4,4'-methylene bisphenol is significantly different from the reactivity of hydroxy groups respectively bound to the four phenyl groups of the two diphenylmethyl substituents. COPYRIGHT: (C)2008,JPO&INPIT
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