发明名称 E-beam cured packaging structure, packages, and methods of making
摘要 Flexible retort packaging structures, including retort pouches and methods of making both the packaging structures and pouches, wherein an otherwise conventional flexible retort substrate is surface printed, the printed image is optionally overcoated with a protective overcoating material. The printing is accordingly located outwardly of the outer structural layer of the substrate and an overcoating is optionally applied over the printing, such that the printed image is between the optional overcoating and the outer-most structural layer of the substrate. The printed images and optional overcoating are simultaneously cured in an electron beam irradiation process.
申请公布号 US2007292567(A1) 申请公布日期 2007.12.20
申请号 US20060646808 申请日期 2006.12.27
申请人 LITHOTYPE COMPANY, INC. 发明人 KAAS ROGER L.;GEHRKE RUSS P.;KILLORAN TIMOTHY P.;LEE KILLORAN SANDRA;HINES MARK;GASSMAN GARY A.
分类号 B65D85/00;B29D22/00;B32B1/08;B65B55/00 主分类号 B65D85/00
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