发明名称 THERMOCOMPRESSION BONDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method of thermocompression bonding which can efficiently cool a thermocompression bonding tool. SOLUTION: A heat conductor 20 is provided so as to contact the upper part of a heater 5 for heating a pressing surface 2a provided on the lower part of the thermocompression bonding tool 2. The heat conductor 20 has a heat conduction rate higher than that of a heat insulation part 21 for insulating the conduction of heat from the heater 5 to the upper part, and has high effect of radiating heat from the heater 5. Thus, the thermocompression bonding tool 2 can be efficiently cooled and a cooling time can be shortened. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329306(A) 申请公布日期 2007.12.20
申请号 JP20060159450 申请日期 2006.06.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKANISHI TOMOAKI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址